The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jan. 04, 2022
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Seung Jin Lee, Seoul, KR;

Hyung Kyu Yoon, Seoul, KR;

Hye Yeong Jung, Seoul, KR;

Jung Hun Oh, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 3/26 (2006.01); G03B 5/02 (2021.01); H01F 27/28 (2006.01); H02K 3/44 (2006.01); H02K 41/035 (2006.01);
U.S. Cl.
CPC ...
H02K 3/26 (2013.01); G03B 5/02 (2013.01); H01F 27/2804 (2013.01); H02K 3/44 (2013.01); H02K 41/0354 (2013.01); H02K 2203/03 (2013.01);
Abstract

A coil member according to an embodiment comprises: a substrate having a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; and a plurality of bridge portions protruding from an end of the substrate, wherein the bridge portions are integrally formed with the substrate, and a shield layer is disposed on the bridge portions.


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Lee, Seung. (2026). Coil member comprising a circuit pattern including a plurality of metal layers sequentially stacked and camera module comprising same (U.S. Patent No. 12776678). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776678

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