The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Oct. 19, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuto Shiga, Tokyo, JP;

Kazuya Tobita, Tokyo, JP;

Youichi Kazuta, Tokyo, JP;

Yuichi Takubo, Tokyo, JP;

Toshinori Matsuura, Tokyo, JP;

Junichiro Urabe, Tokyo, JP;

Noriaki Hamachi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A multilayer coil component includes an element body including a main surface, a coil disposed in the element body, and an external electrode electrically connected to the coil. The external electrode includes an underlying metal layer disposed on the element body and a plated layer in contact with a surface of the underlying metal layer. The underlying metal layer includes a main surface electrode portion exposed from the main surface. At least one recess that opens to at least a surface of the main surface electrode portion is formed in the main surface electrode portion.


Find Patent Forward Citations

Shiga, Yuto. (2026). Multilayer coil component (U.S. Patent No. 12776437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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