The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 26, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Takuma Sagara, Nagaokakyo, JP;

Katsuyuki Takahashi, Nagaokakyo, JP;

Shingo Nakamoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/24 (2013.01); H01F 27/29 (2013.01);
Abstract

To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.


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Sagara, Takuma. (2026). Coil component (U.S. Patent No. 12776435). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776435

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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