The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12776428 B1

Date of Patent:

Oct. 27, 2026

Filed:

Apr. 01, 2021

Injection-molded wire harness and molding method

Applicant:

Changchung Jetty Automotive Technology Co., Ltd., Changchun City, CN;

Inventor:

Chao Wang, Changchun City, CN;

Assignee:

CHANGCHUN JETTY AUTOMOTIVE TECHNOLOGY CO., LTD., Changchun City, CN;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Travis S Chambers

Int. Cl.

CPC ...

H01B 7/40 (2006.01); H01B 7/00 (2006.01); H01B 13/06 (2006.01); H01R 4/70 (2006.01); H01R 13/52 (2006.01); H01R 43/00 (2006.01); H01R 43/24 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01);

U.S. Cl.

CPC ...

H01B 7/40 (2013.01); H01B 7/0045 (2013.01); H01B 13/06 (2013.01); H01R 4/70 (2013.01); H01R 13/5205 (2013.01); H01R 43/005 (2013.01); H01R 43/24 (2013.01); B29C 45/14639 (2013.01); B29L 2031/3462 (2013.01);

Abstract

An injection molded wire harness and a molding method. The wire harness includes a terminal and at least one conductor. One end of the terminal is connected to an electrical circuit of an electrical device, and the other end of the terminal is connected to the conductor. The wire harness is provided with a protective layer which is injection-molded and wraps the conductor, and at least one positioning device that is injection molded for fixing the position of the wire harness and/or at least one sealing device that is injection molded for waterproofing. The method can reduce manual operation, improve consistency of wire harness products, reduce production cost of wire harness products, and prolong the service life of the wire harness.

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Wang, Chao. (2026). Injection-molded wire harness and molding method (U.S. Patent No. 12776428). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776428

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