The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Aug. 30, 2021
Applicant:

Siemens Industry Software Inc., Plano, TX (US);

Inventors:

Young Chang Kim, San Jose, CA (US);

Marko P. Chew, Palo Alto, CA (US);

Lianghong Yin, Fremont, CA (US);

Abhinandan Nath, Guwahati, IN;

John L. Sturtevant, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/706839 (2023.05); G03F 7/705 (2013.01); G03F 7/70633 (2013.01); G03F 7/7065 (2013.01);
Abstract

This application discloses a hotspot identification system to generate process variability bands for structures of an integrated circuit capable of being fabricated utilizing at least one lithographic mask based, at least in part, on a mask layout data describing the lithographic mask and a distribution of manufacturing parameters during fabrication. The hotspot identification system can utilize the process variability bands to identify a subset of the structures that correspond to hotspots in the integrated circuit and identify corresponding values for the manufacturing parameters associated with the identified hotspots. A wafer testing system can implement a real-time wafer assessment process by comparing measured manufacturing parameters associated with a fabricated integrated circuit to the values for the manufacturing parameters associated with the identified hotspots, and dynamically identifying a disposition for the fabricated integrated circuit corresponding to one or more structures associated with the identified hotspot based on the comparison.


Find Patent Forward Citations

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Kim, Young. (2026). Real-time patterning hotspot analyzer (U.S. Patent No. 12775219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12775219

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