The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Oct. 22, 2024
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshinori Kotani, Kanagawa, JP;

Hiroshi Saito, Kanagawa, JP;

Nobuki Yoshimatsu, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/65 (2006.01); G01J 3/44 (2006.01);
U.S. Cl.
CPC ...
G01N 21/658 (2013.01); G01J 3/4412 (2013.01); G01N 21/65 (2013.01);
Abstract

A substrate includes projections containing metal. The projections include a first projection on which a first metal portion is formed, the first metal portion containing at least one of gold, silver, platinum, copper, and palladium. The projections include a second projection that is different from the first projection and on which a second metal portion is formed, the second metal portion containing at least one of gold, silver, platinum, copper, and palladium. The substrate further includes a dielectric portion that is present between the first projection and the first metal portion and between the second projection and the second metal portion. A surface of the dielectric portion facing opposite to the projections follows shapes of the projections. A gap is provided between the first metal portion and the second metal portion, and a distance between the first metal portion and the second metal portion is 50 nm or less.


Find Patent Forward Citations

Kotani, Yoshinori. (2026). Substrate, analysis method, apparatus, and method of manufacturing substrate (U.S. Patent No. 12774961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12774961

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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