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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12774146 B1

PDFFull Text
Date of Patent:
Oct. 27, 2026

Filed:

Mar. 01, 2022

Packaging bag for filling crushed polysilicon material and polysilicon package

Applicant:

Tokuyama Corporation, Yamaguchi, JP;

Inventors:

Takuya Asano, Yamaguchi, JP;

Takuya Yokose, Yamaguchi, JP;

Toru Onoda, Yamaguchi, JP;

Assignee:

TOKUYAMA CORPORATION, Yamaguchi, JP;

Attorneys:

Casimir Jones, S.C.

Robert A. Goetz

Primary Examiner:

Michael C Miggins

Int. Cl.
CPC ...
B65D 81/24 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B65D 65/40 (2006.01); B65D 77/04 (2006.01);
U.S. Cl.
CPC ...
B65D 81/24 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B65D 65/40 (2013.01); B65D 77/04 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2307/581 (2013.01); B32B 2307/7246 (2013.01); B32B 2439/46 (2013.01); B65D 2565/387 (2013.01);
Abstract

A packaging bag according to the present invention for packing a crushed polysilicon material is a packaging bag () for directly packaging a crushed polysilicon material and includes a multi-layer film in which an additive-free polyethylene-based resin layer () is disposed in an innermost layer, and, on the polyethylene-based resin layer, at least a gas barrier layer () and a reinforcing material layer () are stacked.

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Quick Actions:

Asano, Takuya. (2026). Packaging bag for filling crushed polysilicon material and polysilicon package (U.S. Patent No. 12774146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12774146

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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