The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
May. 03, 2024
Mediatek Inc., Hsinchu City, TW;
Shu-Yuan Tseng, Hsinchu City, TW;
Sheng-Yuan Fu, Hsinchu City, TW;
Duen-Yi Ho, Hsinchu City, TW;
Chia-Yu Jin, Hsinchu City, TW;
MEDIATEK INC., Hsinchu City, TW;
Abstract
An electronic device used in the Universal Chiplet Interconnect Express (UCIe) standard is provided. The electronic device includes a substrate and first and second semiconductor devices. The first and second semiconductor devices are disposed on a top surface of the substrate. The substrate includes an interconnect structure electrically connected between the first and second semiconductor devices. The interconnect structure includes a first pad, a first signal trace and first and second via structures. The first pad is located on the top surface of the substrate. The first signal trace is covered by the first and second semiconductor devices. The first via structure is electrically connected between the first pad and the first signal trace. The second via structure is electrically connected between the first via structure and the first signal trace. The first via structure is misaligned with the second via structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile