The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Oct. 27, 2023
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Mayank Mayukh, Fort Collins, CO (US);
Shrikara Prabhu Tendel, Singapore, SG;
Jayanthi Pallinti, Los Gatos, CA (US);
Gregory Dix, Fort Collins, CO (US);
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Abstract
The subject technology is directed to semiconductor devices and manufacturing methods. In various embodiments, the subject technology provides a method for manufacturing a semiconductor device, which comprises forming a substrate and coupling a first circuit to the substrate. The first circuit is characterized by a first coefficient of thermal expansion (CTE) and the substrate is characterized by a second CTE. A ratio of the first CTE to the second CTE is greater than or equal to 3:5, which ensures harmonious thermal behavior, leading to improved yield and reduced warpage. In some implementations, one or more circuit elements may be embedded in the substrate. There are other embodiments as well.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile