The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Apr. 12, 2024
Stats Chippac Pte. Ltd., Singapore, SG;
Changoh Kim, Incheon, KR;
Jinhee Jung, Incheon, KR;
Abstract
A method for forming a shielding layer over a semiconductor package is provided. The method comprises: providing a jig having a metal frame and a carrier tape attached onto the metal frame via an adhesive layer; forming an opening through the adhesive layer and the carrier tape; disposing a semiconductor package on the jig over the opening such that the semiconductor package is supported on and attached to the carrier tape via the adhesive layer; forming a groove in the adhesive layer and around the opening by isotropic etching; forming a shielding layer over the semiconductor package and the jig; and removing the semiconductor package with the shielding layer from the jig.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile