The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Apr. 11, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sujie Kang, Suwon-si, KR;
Minsoo Han, Suwon-si, KR;
Minwoo Rhee, Suwon-si, KR;
Kyoungwhan Oh, Suwon-si, KR;
Kyeongbin Lim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile