The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Aug. 25, 2022
Applicant:

American Axle & Manufacturing, Inc., Detroit, MI (US);

Inventors:

David Crecelius, Cicero, IN (US);

Charles G. Stuart, Rochester Hills, MI (US);

Cory J. Padfield, Royal Oak, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H10W 40/00 (2026.01); H10W 40/20 (2026.01); H10W 40/22 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/037 (2026.01); H10W 40/228 (2026.01); H10W 40/235 (2026.01); H10W 40/242 (2026.01); H10W 90/756 (2026.01);
Abstract

A method for forming a heat-sinked power semiconductor. The method includes: providing a power semiconductor having a power semiconductor die, a plurality of pin terminals and a plate terminal, the power semiconductor die having a plurality of semiconductor terminals, each of the pin terminals being electrically coupled to a corresponding one of the semiconductor terminals, the plate terminal being electrically coupled to one of the pin terminals, the plate terminal having an exterior surface that is covered with at least one sinter-resistant material; removing the at least one sinter-resistant material from the plate terminal to expose the exterior surface; heating a heat sink to a predetermined temperature; and sintering the heat sink to the exterior surface of the plate terminal.


Find Patent Forward Citations

Quick Actions:

Crecelius, David. (2026). Method for forming a heat-sinked power semiconductor (U.S. Patent No. 12772838). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772838

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…