The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Aug. 28, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Shingo Honda, Yokkaichi Mie, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10B 69/00 (2023.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/082 (2026.01); H10B 69/00 (2023.02); H10W 20/42 (2026.01);
Abstract

A semiconductor device includes a first layer including a first recess portion on an upper surface; and a second recess portion that extends from a bottom surface of the first recess portion in the first layer, and the second recess portion has a tapered shape in which a width in a first direction along a surface direction of the first layer reduces from the bottom surface of the first recess portion in a depth direction of the first layer.


Find Patent Forward Citations

Honda, Shingo. (2026). Semiconductor device (U.S. Patent No. 12772817). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772817

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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