The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Feb. 02, 2023
Skyworks Solutions, Inc., Irvine, CA (US);
Guillaume Alexandre Blin, Carlisle, MA (US);
Engin Ibrahim Pehlivanoglu, Costa Mesa, CA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
A semiconductor wafer comprising a first die including a first integrated circuit having a trimmable or programmable component. The trimmable or programmable component is configured to be trimmed or permanently altered in response to an electrical signal. The semiconductor wafer includes a second die arranged adjacent to the first die. The second die includes a second integrated circuit and at least one contact pad arranged to allow an electrical connection to be made to the second integrated circuit. The at least one contact pad is additionally electrically connected to the at least one trimmable or programmable component of the first die such that the at least one contact pad of the second die is configured to act as a probe pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile