The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Sep. 15, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Masako Sueyoshi, Toyama, JP;

Makoto Nomura, Toyama, JP;

Taku Hisada, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G05B 19/18 (2006.01); H10P 72/00 (2026.01); H10P 95/90 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0602 (2026.01); G05B 19/188 (2013.01); H10P 72/0436 (2026.01); H10P 95/90 (2026.01); G05B 2219/45031 (2013.01);
Abstract

There is provided a technique that includes: a storage storing at least a temperature control table where a set value of a heater heating a substrate and a set value of a lamp heating the substrate are set for a target temperature of the substrate, and a process recipe constituted by steps of processing the substrate; and a controller capable of performing a control of executing the process recipe, wherein the controller is capable of performing a control of: searching the temperature control table with target temperature corresponding to a substrate temperature set in the process recipe; and setting a set value for the target temperature corresponding to the substrate temperature to at least one selected from the group of a temperature set value of the heater, a temperature ratio of the heater, a power set value of the lamp, and a lamp rate value in the process recipe.


Find Patent Forward Citations

Sueyoshi, Masako. (2026). Processing apparatus, recording medium, substrate processing method, and method of manufacturing semiconductor device (U.S. Patent No. 12772780). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772780

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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