The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Nov. 07, 2023
Applicant:
Hrl Laboratories, Llc, Malibu, CA (US);
Inventors:
Andrew C. Keefe, Encino, CA (US);
Geoffrey P. Mcknight, Los Angeles, CA (US);
Alexander R. Gurga, Canoga Park, CA (US);
Ryan Freeman, Los Angeles, CA (US);
Assignee:
HRL LABORATORIES, LLC, Malibu, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/011 (2025.01); H10F 39/8027 (2025.01); H10F 39/80 (2025.01);
Abstract
A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.
Keefe, Andrew. (2026). Curved semiconductor and method of forming the same (U.S. Patent No. 12772579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772579
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile