The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jun. 10, 2024
Socionext Inc., Kanagawa, JP;
SOCIONEXT INC., Kanagawa, JP;
Abstract
First and second semiconductor chips are stacked one upon the other with the back face of the first semiconductor chip opposed to the principal face of the second semiconductor chip. The first semiconductor chip includes: first and second power lines formed in a buried interconnect layer, extending in the X direction, and adjoining each other in the Y direction; first and second contacts provided between the first and second power lines and the chip back face; and a third contact provided between a signal line and the chip back face. The third contact is located between the first and second power lines in the Y direction, and at a position different from the positions of the first and second contacts in the X direction, in planar view.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile