The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Sep. 08, 2023
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Takayuki Beppu, Yokkaichi Mie, JP;
Hiroko Tahara, Yokkaichi Mie, JP;
Masayuki Kitamura, Yokkaichi Mie, JP;
Hiroshi Toyoda, Kamakura Kanagawa, JP;
Hiroyuki Ohtori, Yokkaichi Mie, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/66 (2025.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10D 64/665 (2025.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02); H10W 20/435 (2026.01);
Abstract
In one embodiment, a semiconductor device includes a first layer including a metal element. The device further includes a first insulator that is in contact with the first layer and includes silicon and oxygen. The device further includes a second layer that is in contact with the first insulator and includes molybdenum or tungsten.
Beppu, Takayuki. (2026). Three-dimensinal semiconductor memory device and method of manufacturing the same (U.S. Patent No. 12772538). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772538
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile