The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Oct. 03, 2023
Applicant:

Japan Display Inc., Tokyo, JP;

Inventors:

Hajime Watakabe, Tokyo, JP;

Masashi Tsubuku, Tokyo, JP;

Toshinari Sasaki, Tokyo, JP;

Akihiro Hanada, Tokyo, JP;

Takaya Tamaru, Tokyo, JP;

Assignee:

Japan Display Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 21/425 (2006.01); H01L 21/4757 (2006.01); H10D 30/67 (2025.01); H10D 99/00 (2025.01); H10P 14/20 (2026.01); H10P 14/22 (2026.01); H10P 30/20 (2026.01); H10P 30/40 (2026.01);
U.S. Cl.
CPC ...
H10D 30/6755 (2025.01); H10D 30/6723 (2025.01); H10D 30/673 (2025.01); H10D 30/6739 (2025.01); H10D 30/6757 (2025.01); H10D 99/00 (2025.01); H10P 14/22 (2026.01); H10P 14/3434 (2026.01); H10P 30/202 (2026.01); H10P 30/40 (2026.01); H10D 30/6736 (2025.01);
Abstract

A semiconductor device according to an embodiment includes: an oxide insulating layer; an oxide semiconductor layer; a gate electrode; a gate insulating layer; and a first insulating layer, wherein the semiconductor device is divided into a first to a third regions, a thickness of the gate insulating layer in the first region is 200 nm or more, the gate electrode contacts the first insulating layer in the first region, the oxide semiconductor layer contacts the first insulating layer in the second region, an amount of impurities contained in the oxide semiconductor layer in the second region is greater than an amount of impurities contained in the oxide semiconductor layer in the first region, and an amount of impurities contained in the oxide insulating layer in the third region is greater than an amount of impurities contained in the oxide insulating layer in the second region.


Find Patent Forward Citations

Watakabe, Hajime. (2026). Semiconductor device and method for manufacturing semiconductor device (U.S. Patent No. 12772502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772502

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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