The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jun. 15, 2021
Applicant:

Lg Energy Solution, Ltd., Seoul, KR;

Inventors:

Bum Jick Lee, Daejeon, KR;

Young Su Son, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); B60L 58/10 (2019.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); B60L 58/10 (2019.02);
Abstract

The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer.


Find Patent Forward Citations

Lee, Bum. (2026). Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same (U.S. Patent No. 12772386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772386

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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