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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12772376 B1

PDFFull Text
Date of Patent:
Oct. 20, 2026

Filed:

Jul. 25, 2022

Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same

Applicant:

Lotte Energy Materials Corporation, Jeollabuk-do, KR;

Inventors:

Jung Woo Seo, Jeollabuk-do, KR;

Chang Yol Yang, Jeollabuk-do, KR;

Kideok Song, Jeollabuk-do, KR;

Eun Sil Choi, Jeollabuk-do, KR;

Assignee:

LOTTE ENERGY MATERIALS CORPORATON, Jeollabuk-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Amol H Patel

Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C23C 22/24 (2006.01); C23C 28/00 (2006.01); C25D 5/00 (2006.01); C25D 5/10 (2006.01); C25D 7/06 (2006.01); C25D 9/08 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 2201/015 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01);
Abstract

Disclosed is a surface-treated copper foil having long-term high-temperature reliability and being suitable for use in high-frequency circuits due to a low transmission loss, wherein the surface-treated copper foil has a surface treatment layer, the surface treatment layer including: a primary particle layer containing Cu or Cu alloy particles formed on at least one surface of an original copper foil; and a secondary particle layer containing Zn particles formed on the primary particle layer, the secondary particle layer being composed of particle clusters formed by clustering of a plurality of Zn particles.

Find Patent Forward Citations

Seo, Jung. (2026). Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same (U.S. Patent No. 12772376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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