The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Apr. 19, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jin UK Lee, Suwon-si, KR;

Chi Hyeon Jeong, Suwon-si, KR;

Youn Gyu Han, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 2201/09327 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/09536 (2013.01);
Abstract

The present disclosure relates to a printed circuit board including: an insulating layer; and a plurality of wiring layers disposed in the insulating layer, wherein the plurality of wiring layers include a first wiring layer, a second wiring layer disposed on the first wiring layer, and a third wiring layer disposed on the second wiring layer, the second wiring layer is thicker than each of the first and third wiring layers, and the second wiring layer includes one or microcircuit patterns and has an aspect ratio, which is a ratio of a height to a line width, being 2.4 to 3.6.


Find Patent Forward Citations

Lee, Jin. (2026). Printed circuit board (U.S. Patent No. 12772375). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772375

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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