The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Oct. 28, 2024
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;

Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;

Garuda Technology Co., Ltd., New Taipei City, TW;

Inventor:

Cheng-Jia Li, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2026.01); H05K 1/02 (2006.01); H05K 1/185 (2026.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 3/22 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10053 (2013.01);
Abstract

A circuit board having a switch includes an insulation material layer, first and second insulation layers, a circular channel, a first cover layer, an inert liquid material, a first conductive block, a second conductive block and a conductive layer. The first and second insulation layers are respectively on bottom and top surfaces of the insulation material layer. The circular channel is in the first and second insulation layers and the insulation material layer, and includes a first sub-channel, a second sub-channel, a first connection channel and a second connection channel. The first cover layer is on a bottom surface of the first insulation layer. The inert liquid material is in the circular channel. The first conductive block is in the first sub-channel. The second conductive block is in the second sub-channel. The conductive layer is in the insulation material layer and adjacent to the circular channel.


Find Patent Forward Citations

Li, Cheng-Jia. (2026). Circuit board having a switch and method for fabricating the same (U.S. Patent No. 12772374). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772374

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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