The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jul. 19, 2024
Asustek Computer Inc., Taipei City, TW;
ASUSTek COMPUTER INC., Taipei City, TW;
Abstract
A heat dissipation module is adapted to be installed on a motherboard having a connector. The connector is adapted to connect an interface card. The heat dissipation module includes a base assembly adapted to be fixed on the motherboard, a heat dissipation member, and a fastening member. The base assembly is an integrated base body having opposite first and second ends. The first end is adjacent to the connector and has a fixing portion. The second end has a fastening portion. The interface card is adapted to be installed between the first end and the second end. The heat dissipation member has opposite third and fourth ends. The third end is adapted to be detachably connected to the fixing portion. The fastening member is pivoted on the fourth end and adapted to be detachably connected to the fastening portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile