The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Nov. 18, 2022
Applicant:

Shenzhen Newsonic Technologies Co., Ltd., Shenzhen, CN;

Inventor:

Guojun Weng, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H03H 9/0561 (2013.01); H03H 9/14541 (2013.01);
Abstract

A surface acoustic wave (SAW) filter includes a filter wafer including: a first substrate; and an interdigital transducer (IDT) disposed on the first substrate, the IDT including a first input and output end, a second input and output end, and an interdigital portion. The SAW filter also includes a dielectric layer disposed on the filter wafer, covering the first input and output end and the second input and output end of the IDT and exposing the interdigital portion; a passivation layer disposed on the dielectric layer; a bonding layer disposed on the passivation layer; a second substrate bonded to the filter wafer via the bonding layer; and a cavity enclosed by the second substrate and the bonding layer.


Find Patent Forward Citations

Weng, Guojun. (2026). Surface acoustic wave filter wafer-level packaging structure and method (U.S. Patent No. 12771312). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12771312

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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