The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jul. 11, 2024
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Shinya Jonosono, Nagaokakyo, JP;

Takashi Yamane, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02228 (2013.01); H03H 9/02015 (2013.01); H03H 9/02157 (2013.01);
Abstract

A method for manufacturing an acoustic wave element includes preparing a wafer, attaching the wafer to a dicing tape, dicing the wafer to singulate the acoustic wave element, and abutting a pin against the acoustic wave element with the dicing tape interposed therebetween to separate the acoustic wave element from the dicing tape, and pick up the acoustic wave element. A position at which the pin is abutted against the acoustic wave element overlaps a hollow portion in a support of the acoustic wave element in a lamination direction.


Find Patent Forward Citations

Jonosono, Shinya. (2026). Method for manufacturing acoustic wave element and acoustic wave element (U.S. Patent No. 12771310). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12771310

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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