The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jul. 21, 2022
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Masaki Wakaba, Tokyo, JP;

Kazuomi Maruyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/10 (2021.01); H01S 5/227 (2006.01); H01S 5/068 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02453 (2013.01); H01S 5/026 (2013.01); H01S 5/1007 (2013.01); H01S 5/227 (2013.01); H01S 5/068 (2013.01);
Abstract

A semiconductor device includes: a base including a base surface; a mesa protruding from the base surface in a first direction intersecting the base surface, the mesa including a top surface and two side surfaces on both sides of the top surface, and extending along the base surface; and an electric resistor including a top wall provided on the top surface and a side wall provided on at least one of the two side surfaces, the electric resistor being configured such that a current flows in an extending direction of the mesa.


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Wakaba, Masaki. (2026). Semiconductor device (U.S. Patent No. 12771094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12771094

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