The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jul. 12, 2022
Applicant:

The Yokohama Rubber Co., Ltd., Hiratsuka, JP;

Inventors:

Hirokazu Kageyama, Hiratsuka, JP;

Kazushi Kimura, Hiratsuka, JP;

Yutaro Yamamoto, Hiratsuka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C08G 18/08 (2006.01); C08G 18/10 (2006.01); C08G 18/32 (2006.01); C08G 18/44 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C09J 5/00 (2006.01); C09J 175/04 (2006.01); C09J 175/06 (2006.01);
U.S. Cl.
CPC ...
C09J 175/08 (2013.01); C08G 18/0838 (2013.01); C08G 18/10 (2013.01); C08G 18/4833 (2013.01); C09J 5/00 (2013.01);
Abstract

A two-pack type curable adhesive composition includes a base containing a urethane prepolymer having an isocyanate group, and a curing agent. At least one of the base and the curing agent contains polymer particulates having an average particle size of from 0.01 to 200 μm, the polymer particulates having a glass transition temperature of from −40° C. to +80° C., a content of the polymer particulates is ≥5 mass % in a total amount of the adhesive composition. A cured product of the adhesive composition has a loss tangent of ≥0.15 under a temperature region of from −40° C. to +80° C. and a frequency of 100 Hz, and the cured product not breaking under a stress amplitude of 2.8 MPa and a repetition number of up to 10times in a tensile shear fatigue property test JIS K6864.


Find Patent Forward Citations

Kageyama, Hirokazu. (2026). Two-pack type curable adhesive composition (U.S. Patent No. 12767868). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12767868

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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