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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12767836 B1

PDFFull Text
Date of Patent:
Oct. 20, 2026

Filed:

Oct. 02, 2023

Thermally processible piezoelectric compositions containing a thermal crosslinking agent and methods associated therewith

Applicant:

Genesee Valley Innovations, Llc, Santa Clara, CA (US);

Inventors:

Alexandros Vasileiou, Toronto, CA;

Sarah J. Vella, Milton, CA;

Edward G. Zwartz, Mississauga, CA;

Assignee:

GENESEE VALLEY INNOVATIONS, LLC, Santa Clara, CA (US);

Attorney:

Vorys, Sater, Seymour and Pease LLP

Primary Examiner:

Anita Nassiri-Motlagh

Int. Cl.
CPC ...
C09D 5/24 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08K 3/22 (2006.01); C08K 5/1539 (2006.01); C08K 5/3417 (2006.01); C08K 9/04 (2006.01); C09D 7/62 (2018.01); C09D 7/63 (2018.01); C09D 177/02 (2006.01); H10N 30/045 (2023.01); H10N 30/092 (2023.01); H10N 30/85 (2023.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 7/62 (2018.01); C09D 7/63 (2018.01); C09D 177/02 (2013.01); H10N 30/045 (2023.02); H10N 30/092 (2023.02); H10N 30/852 (2023.02); C08K 2003/2244 (2013.01); C08K 5/1539 (2013.01); C08K 5/3417 (2013.01); C08K 9/04 (2013.01); C08K 2201/001 (2013.01);
Abstract

Parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles dispersed in at least a portion of a polymer material comprising at least one thermoplastic polymer, and at least one thermal crosslinking agent dispersed in at least a portion of the polymer material. The composition is formable at a melt processing temperature that is at or above a melting point or softening temperature of the at least one thermoplastic polymer for a melt processing time that retains at least a majority of the at least one thermal crosslinking agent in a non-crosslinked state. The at least one thermal crosslinking agent may be present in the polymer material a) covalently bonded to at least a portion of the polymer material, b) covalently bonded to at least a portion of the piezoelectric particles, or c) any combination thereof.

Find Patent Forward Citations

Vasileiou, Alexandros. (2026). Thermally processible piezoelectric compositions containing a thermal crosslinking agent and methods associated therewith (U.S. Patent No. 12767836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12767836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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