The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Mar. 15, 2021
Applicant:
Sika Technology Ag, Baar, CH;
Inventors:
Shunsuke Yamada, Chigasaki, JP;
Satoshi Urayama, Tokyo, JP;
Assignee:
SIKA TECHNOLOGY AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 13/04 (2006.01); C08J 9/00 (2006.01); C08J 9/32 (2006.01);
U.S. Cl.
CPC ...
C08K 13/04 (2013.01); C08J 9/0028 (2013.01); C08J 9/0061 (2013.01); C08J 9/0066 (2013.01); C08J 9/0085 (2013.01); C08J 9/32 (2013.01); C08J 2203/22 (2013.01); C08J 2363/00 (2013.01); C08J 2409/06 (2013.01);
Abstract
A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.
Yamada, Shunsuke. (2026). One-component thermosetting epoxy composition with improved adhesion (U.S. Patent No. 12767792). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12767792
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile