The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Nov. 21, 2022
Dowa Metaltech Co., Ltd., Tokyo, JP;
Seiya Yuki, Tokyo, JP;
Yuki Teramoto, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
A copper-ceramic bonded substrate, including: a ceramic substrate; and a copper sheet bonded to at least one surface of the ceramic substrate, where a dislocation density of the copper sheet ism-or less. And, methods for manufacturing a copper-ceramic bonded substrate, the methods including: placing a copper sheet having an arsenic content ofppm toppm and an antimony content ofppm toppm on at least one surface of a ceramic substrate; and heating and bonding them together, where a dislocation density after bonding of the copper sheet ismor less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile