The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jun. 27, 2024
Applicant:
Coorstek Gk, Tokyo, JP;
Inventors:
Kanta Doi, Yamagata, JP;
Kenta Ogama, Nishiokitamagun, JP;
Assignee:
CoorsTek GK, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); C03B 23/20 (2006.01); C03C 3/06 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
C03B 23/20 (2013.01); C03C 3/06 (2013.01); C03C 2201/32 (2013.01); H10P 72/0431 (2026.01);
Abstract
A semiconductor heat treatment member includes a plurality of quartz glass members fused to one another, a plurality of devitrified portions are formed in a fused portion at which the quartz glass members are fused, a maximum cross-sectional area of one devitrified portion among the plurality of devitrified portions is 1.76 mmor less, and an area occupancy ratio of a total area of the plurality of devitrified portions to an area of a cross section of the fused portion is 10% or less.
Doi, Kanta. (2026). Semiconductor heat treatment member (U.S. Patent No. 12767578). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12767578
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile