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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12766922 B1

PDFFull Text
Date of Patent:
Oct. 20, 2026

Filed:

Jul. 21, 2023

Thermal management system

Applicant:

Denso Corporation, Kariya-city, JP;

Inventors:

Takahiro Maeda, Kariya-city, JP;

Shota Terachi, Kariya-city, JP;

Kenshiro Matsui, Kariya-city, JP;

Takeshi Yoshinori, Kariya-city, JP;

Shinya Kasamatsu, Kariya-city, JP;

Assignee:

DENSO CORPORATION, Kariya-city, JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Tho V Duong

Int. Cl.
CPC ...
B60H 1/00 (2006.01); B60H 1/14 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00921 (2013.01); B60H 1/00278 (2013.01); B60H 1/143 (2013.01); B60H 2001/00307 (2013.01); B60H 2001/00928 (2013.01);
Abstract

A thermal management system includes refrigeration cycle equipment and a heating medium circuit. The heating medium circuit includes a high-temperature-side circuit connecting with the heating medium channel of the high-temperature-side water-refrigerant heat exchange portion, a low-temperature-side circuit connecting with a heating medium channel of a low-temperature-side water-refrigerant heat exchange portion, and a heat transfer portion connecting the high-temperature-side circuit and the low-temperature-side circuit. The low-temperature-side circuit includes a first heat exchange portion, a second heat exchange portion, a heating medium bypass channel, and a low-temperature-side circuit switching portion. While the heat transfer portion is transferring heat, the low-temperature-side circuit switching portion switches a circuit configuration of the low-temperature-side circuit to a circuit configuration that circulates the heating medium between the first heat exchange portion and the heating medium bypass channel.

Find Patent Forward Citations

Maeda, Takahiro. (2026). Thermal management system (U.S. Patent No. 12766922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766922

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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