The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jun. 17, 2022
Applicant:

Nachi-fujikoshi Corp., Tokyo, JP;

Inventors:

Daisaku Uchijima, Toyama, JP;

Terumasa Sawato, Toyama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01);
U.S. Cl.
CPC ...
B25J 15/0616 (2013.01);
Abstract

To provide an electronic device assembly apparatus and an electronic device assembly method for enabling to provide a reliable connection work for multiple types of cables having different widths while straightening a cable warp. An electronic device assembly apparatus includes a robot control device that controls a gripping device that grips a flexible flat cable and a robot arm that moves the gripping device relative to a circuit board. The gripping device includes: a suction device for sucking and holding a surface of the cable; and gripping claws for sandwiching and hold the cable. The gripping claws has first inclined surfaces formed on inner sides of the gripping claws in the width direction and second inclined surfaces formed at the bottoms of the gripping claws.


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Uchijima, Daisaku. (2026). Electronic device assembly apparatus and electronic device assembly method (U.S. Patent No. 12766744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766744

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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