The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
May. 16, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chia-Hsiang Yen, Chiayi County, TW;
Peng-Chung Jangjian, Zhudong Township, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/005 (2012.01); B24B 53/017 (2012.01); B24B 53/12 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H10P 52/40 (2026.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/0056 (2013.01); B24B 53/017 (2013.01); B24B 53/12 (2013.01); C09G 1/02 (2013.01); C09K 3/1463 (2013.01); H10P 52/403 (2026.01);
Abstract
A chemical mechanical polish apparatus and methods for manufacturing and use of the chemical mechanical polishing apparatus are discussed herein. In an embodiment, a polishing apparatus is provided that includes: a polishing pad coated with polypeptides; and an enzyme spraying device positioned adjacent to the polishing pad.
Yen, Chia-Hsiang. (2026). Polish apparatus and methods for use (U.S. Patent No. 12766664). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766664
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile