The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Mar. 20, 2024
Applicant:

Taichi Metal Material Technology Co., Ltd., Tainan, TW;

Inventors:

Kuan-Wei Chen, Tainan, TW;

Kuan-Yu Chen, Tainan, TW;

Jason Shian-Ching Jang, Tainan, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/12 (2006.01); B24B 7/22 (2006.01); B24B 37/04 (2012.01); B24B 37/08 (2012.01); B24B 57/04 (2006.01);
U.S. Cl.
CPC ...
B24B 7/12 (2013.01); B24B 7/22 (2013.01); B24B 37/042 (2013.01); B24B 37/08 (2013.01); B24B 57/04 (2013.01);
Abstract

A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotation of the main roller to contact and brush the copper foil surface, each metallic-glass particle as cushioned by the main roller may simultaneously polish and grind the copper foil surface for efficiently reducing roughness of copper foil.


Find Patent Forward Citations

Chen, Kuan-Wei. (2026). Process for polishing and grinding copper foil surface for reducing roughness thereof (U.S. Patent No. 12766658). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766658

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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