The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jun. 14, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kentaro Iizuka, Tokyo, JP;

Assignee:

DISCO CORPORATIN, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/00 (2014.01); B23K 103/00 (2006.01); B28D 5/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/0006 (2013.01); B28D 5/0011 (2013.01); B23K 2103/56 (2018.08); B28D 5/0052 (2013.01);
Abstract

Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.


Find Patent Forward Citations

Iizuka, Kentaro. (2026). Marking machine and wafer production system (U.S. Patent No. 12766639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766639

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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