The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Oct. 05, 2022
Mitsubishi Heavy Industries Compressor Corporation, Tokyo, JP;
Yamazaki Mazak Corporation, Aichi, JP;
Yasunori Sakai, Hiroshima, JP;
Daisuke Yamauchi, Hiroshima, JP;
Naoya Hayashida, Hiroshima, JP;
Kazuhiro Ishibashi, Aichi, JP;
Yasuyuki Tanaka, Aichi, JP;
Atsushi Suzuki, Aichi, JP;
Seigo Ouchi, Aichi, JP;
Mitsubishi Heavy Industries Compressor Corporation, Tokyo, JP;
Yamazaki Mazak Corporation, Aichi, JP;
Abstract
A laminate shaping method includes: a unit step repeatedly performed, the unit step including a step of forming a laminate shaped portion by laminating metal layers formed of weld beads, and a step of forming a processed side surface by cutting a shaped portion side surface facing a second direction intersecting a first direction, in which, in the step of forming the processed side surface, the shaped portion side surface is cut so that a receiving portion projecting in the second direction with respect to the processed side surface is formed at an uppermost layer of the laminate shaped portion in the first direction, and when the unit step is repeated, in the step of forming the laminate shaped portion, a new metal layer is laminated so as to overlap an upper surface of the receiving portion in the first direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile