The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

May. 12, 2022
Applicant:

Ryutaro Wada, Tokyo, JP;

Inventor:

Ryutaro Wada, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01J 3/06 (2006.01); B30B 5/02 (2006.01);
U.S. Cl.
CPC ...
B01J 3/06 (2013.01); B01J 3/065 (2013.01); B30B 5/02 (2013.01); B01J 2203/061 (2013.01); B01J 2203/0655 (2013.01);
Abstract

To provide a hydrostatic pressure type high temperature and high-pressure treatment apparatus by a wet method and a dry method for efficiently mass-producing high-quality and large-sized synthetic diamond. In the treatment apparatus, a high-pressure cell prevented from the intrusion of a pressure medium into the inside is housed in a high-pressure container, and hydrostatic pressurization is performed by the liquid pressure medium. At least one pressurizing mechanismfor the pressure mediumis provided, and a pressure medium having a known compressibility and volume change rate is used. A heating mechanism for the pressure medium and a measuring means for the average temperature in the vertical direction are provided, the pressure medium is heated to a predetermined temperature to be thermally expanded, treatment is continued while maintaining the pressure even after the pressurizing mechanism is stopped, and two or more high-pressure cellscan be simultaneously subjected to high-temperature and high-pressure treatment at uniform pressure without directionality.


Find Patent Forward Citations

Wada, Ryutaro. (2026). High-temperature-high-pressure processing unit by solvent application of pressure (U.S. Patent No. 12766475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766475

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