The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Apr. 01, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyoung Lim Suk, Suwon-si, KR;
Kyung Don Mun, Suwon-si, KR;
Inhyung Song, Suwon-si, KR;
Yeonho Jang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package may include a first redistribution layer structure, a chiplet structure on the first redistribution layer structure, a plurality of first connection members on the first redistribution layer structure, a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members, and a second redistribution layer structure on the first molding material. The chiplet structure may include a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile