The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Nov. 24, 2023
Applicant:

Playnitride Display Co., Ltd., MiaoLi County, TW;

Inventors:

PO-Wei Chiu, MiaoLi County, TW;

Sheng-Yuan Sun, MiaoLi County, TW;

Hoong Lien Lai, MiaoLi County, TW;

Loganathan Murugan, MiaoLi County, TW;

Assignee:

PlayNitride Display Co., Ltd., MiaoLi County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H10H 20/80 (2025.01); H10H 20/84 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/84 (2025.01); H10H 20/8513 (2025.01); H10H 20/8514 (2025.01); H10H 20/8515 (2025.01); H10H 20/853 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01); H10H 20/882 (2025.01);
Abstract

An encapsulation structure including a substrate, an isolation structure layer, a planarization layer, and a composite layer structure is disclosed. The isolation structure layer is disposed on the substrate and defines multiple sub-pixel areas. The planarization layer is disposed on the substrate, and has a peripheral portion surrounding and covering the isolation structure layer. A thickness of the peripheral portion increases as it approaches the isolation structure layer. The composite layer structure connects the substrate and covers the planarization layer and the isolation structure layer. The composite layer includes two barrier layers and an extension layer. The extension layer is located between and connects the two barrier layers. A thickness, a water vapor transmission rate, and ductility and malleability of the extension layer are respectively greater than a thickness, a water vapor transmission rate, and ductility and malleability of each of the two barrier layers.


Find Patent Forward Citations

Chiu, PO-Wei. (2026). Encapsulation structure (U.S. Patent No. 12765426). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765426

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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