The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Sep. 15, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seok Geun Ahn, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes; a semiconductor substrate including a device region and an edge region, a first redistribution layer on a lower surface of the semiconductor substrate, a second redistribution layer on an upper surface of the semiconductor substrate, through vias vertically penetrating the semiconductor substrate in the edge region to electrically connect the first redistribution layer and the second redistribution layer, and a circuit layer between the lower surface of the semiconductor substrate and the first redistribution layer. The circuit layer may include; a circuit element on the lower surface of the semiconductor substrate, a circuit wiring pattern electrically connected to the circuit element and the first redistribution layer, and a device interlayer dielectric layer substantially encompassing the circuit element and the circuit wiring pattern, wherein the circuit element and the circuit wiring pattern are disposed in the device region and not in the edge region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile