Double-side cooled power modules with sintered-silver interposers

Abstract

Planar, double-side cooled half-bridge power modules using sintered-silver interposers and all sintered-silver joints are described. Thermo-mechanical simulations showed that use of the sintered-silver interposers reduce the thermo-mechanical stresses at vulnerable interfaces as compared to using solid copper interposers. The porous sintered-silver interposers are also easily deformable under a low load, which improves the yield of module interconnections in the presence of imperfections caused by variations in die thickness, interposer height, and substrate distortion. Results on the electrical performance of the modules validate the fabrication approach for the modules, for making high power-density converters with reliable operations at high junction temperatures.