The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Sep. 01, 2023
Kioxia Corporation, Tokyo, JP;
Soichi Homma, Yokkaichi Mie, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
According to one embodiment, a method of manufacturing a semiconductor device includes etching a sealing resin so that a filler inside the resin is exposed at an outer surface of the resin. The manufacturing method further includes determining the exposed amount of the filler after etching by measuring the optical properties of the surface of the resin. Additional etching may then be performed, if necessary, such that the appropriate amount of filler is exposed from the resin. In subsequent steps, a conductive film may be deposited on the surface of the resin. For example, the conductive film may be used as shield layer of the semiconductor device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile