The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Nov. 07, 2023
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Gary K. Chan, Palo Alto, CA (US);

Umeshbabu Nandanan, Manteca, CA (US);

Phillip S. Ting, San Jose, CA (US);

Mandy H. Lam, Fremont, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); H10W 40/60 (2026.01); H10W 40/73 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/73 (2026.01); H05K 7/20 (2013.01); H10W 40/611 (2026.01); H10W 40/60 (2026.01); H10W 40/625 (2026.01); H10W 72/00 (2026.01); H10W 72/07332 (2026.01); H10W 90/731 (2026.01); H10W 99/00 (2026.01);
Abstract

An apparatus includes a base, an integrated circuit (IC), a thermal interface material (TIM) disposed on the IC, and a heat sink. The heat sink has a vapor chamber (VC) and a condenser coupled with, and spaced from, the VC. The condenser also has a mounting arm extending outward to a side of the condenser. The apparatus further includes a mounting bracket that couples the condenser with the base. The mounting bracket defines one or more oblong holes to accommodate respective horizontally-oriented fasteners that secure the mounting arm to the mounting bracket in such a way that the condenser is oriented and positioned at a height that enables the VC to be arranged on the TIM in a neutral position. A method of assembling such an apparatus is also disclosed.


Find Patent Forward Citations

Chan, Gary. (2026). Remote heat sink side attach methodology (U.S. Patent No. 12765380). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765380

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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