The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Dec. 01, 2022
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Takahiro Wakabayashi, Kumamoto, JP;
Yoichiro Fujinaga, Kanagawa, JP;
Kenichi Taguchi, Kumamoto, JP;
Seiya Tsuzaki, Kumamoto, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
The present technology relates to a semiconductor apparatus that makes it possible to make a sensor-chip package smaller in size, where a Peltier element is arranged in the sensor-chip package. The semiconductor apparatus includes a package that includes a concave portion; a sensor chip that is arranged in the concave portion; and a Peltier element that is arranged between the sensor chip and the package. A back-surface terminal and an upper-surface terminal are electrically connected to each other through a conductive resin, the back-surface terminal being formed on a back surface of a lower substrate of the Peltier element, the upper-surface terminal being formed on an upper surface of the concave portion to face the back-surface terminal. The present technology is applicable to, for example, a semiconductor apparatus that includes a built-in SWIR image sensor.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile