The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jul. 07, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yongjin Kim, Suwon-si, KR;

Sanghoon Ahn, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10P 50/28 (2026.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01); H10W 20/47 (2026.01);
U.S. Cl.
CPC ...
H10W 20/435 (2026.01); H10W 20/035 (2026.01); H10W 20/075 (2026.01); H10W 20/076 (2026.01); H10W 20/089 (2026.01); H10W 20/42 (2026.01); H10W 20/425 (2026.01); H10W 20/47 (2026.01); H10P 50/282 (2026.01);
Abstract

An integrated circuit device includes a plurality of wiring structures on a substrate and extending in a first direction parallel to an upper surface of the substrate and each including a wiring layer on the substrate and extending in a direction perpendicular to the upper surface of the substrate; an insulating pattern surrounding a sidewall of the wiring layer and including a first insulating material; and a capping layer on an upper surface of the wiring layer and including a conductive material; a via layer on the wiring structures, the via layer being electrically connected to one wiring structure; and an interlayer insulating layer covering a sidewall of the insulating pattern between each wiring structure of the plurality of wiring structures, the interlayer insulating layer having an upper surface higher than an upper surface of each wiring layer and an upper surface of each insulating pattern.


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Kim, Yongjin. (2026). Integrated circuit device (U.S. Patent No. 12765363). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765363

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