The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Mar. 11, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Yosuke Nakata, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
In a method for manufacturing a semiconductor device, a back surface of each of plurality of current-carrying semiconductor elements each having a plurality of P-N junction diodes built-in is connected to a first principal surface of a conductor plate. Further, a conductor piece is connected to a front surface of each of the plurality of current-carrying semiconductor elements. Then, a current-carrying test is conducted on the plurality of P-N junction diodes with a second principal surface of the conductor plate exposed on a bottom surface of an intermediate product of a semiconductor device including the plurality of current-carrying semiconductor elements, the conductor plate, and the conductor piece.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile