The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Feb. 02, 2024
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wonjae Lee, Fremont, CA (US);

Pradeep Kumar Subrahmanyan, San Jose, CA (US);

D. Jeffrey Lischer, Acton, MA (US);

Frank Sinclair, Hartland, ME (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/20 (2026.01); C23C 14/48 (2006.01); C23C 14/54 (2006.01); G01B 9/02 (2022.01); G01B 11/16 (2006.01); H10P 14/60 (2026.01); H10P 14/694 (2026.01); H10P 30/20 (2026.01); H10P 30/40 (2026.01); H10P 72/00 (2026.01); H10P 74/00 (2026.01); H10W 42/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/203 (2026.01); C23C 14/48 (2013.01); C23C 14/54 (2013.01); C23C 14/547 (2013.01); G01B 9/02095 (2013.01); G01B 11/16 (2013.01); G01B 11/162 (2013.01); H10P 14/6518 (2026.01); H10P 14/6539 (2026.01); H10P 30/20 (2026.01); H10P 30/40 (2026.01); H10P 72/0616 (2026.01); H10P 74/23 (2026.01); H10W 42/121 (2026.01); H10P 14/69433 (2026.01);
Abstract

Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate. The techniques include obtaining, using optical inspection data, a profile of the out-of-plane deformation of the substrate and identifying, using the obtained profile, one or more parameters characterizing a saddle-shaped stress of the substrate. The techniques further include computing, using the one or more identified parameters, one or more characteristics of a stress-compensation layer (SCL) for the substrate and causing the SCL to be deposited on the substrate. The techniques further include causing a stress-mitigation beam to be applied to a plurality of edge regions of the SCL, wherein settings of the stress-mitigation beam are determined using the one or more identified parameters.


Find Patent Forward Citations

Lee, Wonjae. (2026). Mitigation of saddle deformation of substrates using film deposition and edge ion implantation (U.S. Patent No. 12765326). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765326

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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