The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Mar. 18, 2022
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Katsuji Matsumoto, Kanagawa, JP;
Naoki Kakoiyama, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS COPORATION, Kanagawa, JP;
Abstract
Provided is a semiconductor device having high heat dissipation and high operation reliability. This semiconductor device includes a semiconductor substrate, a first semiconductor layer that is provided on the semiconductor substrate, has a first aperture, and has a first thermal conductivity, a transistor (Tr) provided on the first semiconductor layer, and a heat dissipation unit that is in contact with the semiconductor substrate via the first aperture and has a second thermal conductivity higher than the first thermal conductivity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile